JPH0226235U - - Google Patents
Info
- Publication number
- JPH0226235U JPH0226235U JP10423088U JP10423088U JPH0226235U JP H0226235 U JPH0226235 U JP H0226235U JP 10423088 U JP10423088 U JP 10423088U JP 10423088 U JP10423088 U JP 10423088U JP H0226235 U JPH0226235 U JP H0226235U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- semiconductor package
- base
- gallium arsenide
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10423088U JPH0226235U (en]) | 1988-08-05 | 1988-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10423088U JPH0226235U (en]) | 1988-08-05 | 1988-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226235U true JPH0226235U (en]) | 1990-02-21 |
Family
ID=31335765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10423088U Pending JPH0226235U (en]) | 1988-08-05 | 1988-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226235U (en]) |
-
1988
- 1988-08-05 JP JP10423088U patent/JPH0226235U/ja active Pending